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Generic Requirements for Hybrid Microcircuits Used in Telecommunications Equipment


Document Number TR-NWT-000930
Issue Number 02
Issue Date Sep 1993
Replaces TA-TSY-000930 Issue01
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    ABSTRACT: TR-NWT-000930 presents the Telcordia view of generic requirements for hybrid microcircuits that are, in the opinion of Telcordia,
    currently appropriate for products and equipment used in the network of a typical local exchange carrier (LEC), or other service
    provider. Hybrid microcircuits used in telecommunications are generally an equipment supplier's proprietary technology, with few
    industry-recognized standards to establish common practices and tests necessary to help ensure their quality and reliability.

    This document outlines the Telcordia view of a proposed minimum set of such criteria. For the purpose of this document, a hybrid
    microcircuit is defined as an insulating substrate on which is deposited passive film circuitry, and to which may be attached active
    and passive electronic components. The term is used interchangeably with hybrid circuit, and where active devices are attached, with
    hybrid integrated circuit (HIC).

    This document limits discussion of hybrid microcircuits to electronic assemblies based on ceramic alumina substrates, with passive
    circuitry applied to the substrates to include thin-and thick-film conductors, resistors, and dielectrics.

    Major topics include reliability-oriented requirements for materials and finishes, film circuits, applied components, module
    assembly, and finished hybrids.

    This document replaced TA-TSY-000930.

    When using TR-NWT-000930, you may need to refer to GR-63, GR-78, GR-326, GR-357, GR-468 (replaced TA-TSY-000983
    as well as TR-NWT-000468), GR-1217, GR-1221, and/or SR-NWT-2759 (replaced TR-TSY-000081).

    You may also want to refer to SR-332, TR-NWT-000870, GR-1089, and/or various MIL-STD, ASTM, and other test methods.

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